022What happens to memory prices if AI capex stops growing in 2028?
Memory makers have sold 2027 at prices about six times mid-2025’s, and the fabs they ordered add about a fifth more DRAM bits in 2028. If AI capex in 2028 only matches 2027, and Texas’s slower hookups trim both years, the memory bought for AI in 2028 falls about a quarter short of plan, partly because 2027’s contracted HBM has to be used up first. In 2019, the last time cloud capex stopped growing, DRAM’s price per bit fell by around half. Our model has DRAM contract prices averaging about 50% less in 2028 than in 2027, NAND about 43% less and 2028 HBM contracts about 35% lower. Half off a sixfold rise still leaves DRAM about three times its mid-2025 price.
Where prices stand
Conventional DRAM contract prices rose about sixfold from the third quarter of 2025 to the fourth quarter of 2026, chaining TrendForce’s quarterly estimates. NAND rose about 3.6 times over 2026. DDR4 8Gb, the old PC part, went from $1.35 in early 2025 to $27.50 in October, twenty times. The makers are earning margins memory has never seen: SK hynix an 80% operating margin in the third quarter, Micron an 87% gross margin, SanDisk 85%.
2027 is sold. SK hynix says its 2027 volumes and prices are final and its DRAM and HBM are effectively sold out through 2029, with long-term agreements covering more than half of its 2027–28 capacity. Samsung says its 2027 HBM is sold out, and Micron has agreed the vast majority of its 2027 HBM. The open question is 2028, and it hangs on AI capex: counting HBM at the wafer it takes, we estimate the HBM and CPU memory in AI accelerator servers is about 30% of DRAM demand in 2026 and 37% in 2028 (pack 012, which also counted CPU servers bought for agents, put 2027 near 43%). Counterpoint has servers of every kind at 48% of 2026 DRAM shipments, and HBM at another 9%.
The rises are slowing, and spot has stopped pulling contract up. DRAM spot has barely moved since early October and sits about 70% above October’s DDR4 contract price. NAND wafer spot fell 14% in the four weeks to November 2 as Chinese phone brands cut prices, and October’s MLC contract price was flat, ending a 21-month rise. Buyers are cutting back: IDC expects smartphone shipments to fall 16.7% this year and PCs 11.3%, and SK hynix says some customers are reviewing the timing of their projects.
Contract price rises are slowing
Change in contract prices from the previous quarter, TrendForce, midpoint of each range. 4Q25 and 1Q26 DRAM are actuals; the rest are TrendForce’s forecasts for the quarter. TrendForce’s NAND figure for 4Q25 isn’t shown.
The capex paths
Plan. Pack 010 has worldwide AI capex rising from about $1.0T in 2026 to $1.40T in 2027 and $1.65T in 2028, up 18%. The Street has a little less growth in 2028: Morgan Stanley has hyperscalers and AI cloud providers up about 14%, to $1.8T, and Goldman has the large US hyperscalers at about $1.4T, some $100B above consensus. S&P Global’s models generally assume capex flattens in 2028, and Counterpoint’s memory analyst Kang Kyung-soo has Big Tech’s capex growth approaching zero.
Flat 2028. 2028 spends what 2027 planned to, $1.40T, and growth resumes at the plan’s rates in 2029.
Blue wave. Pack 020 has Texas switching on 2.4 GW less data center load by the end of 2027 than on the path Gov. Greg Abbott had set, and 3.8 GW less by the end of 2028, with Gina Hinojosa as governor, Vikki Goodwin as lieutenant governor and a moratorium until new laws take effect in September 2027. At pack 021’s $50B a gigawatt, three-quarters of it leaving the year the switch-on moves, that takes $89B of AI capex out of 2027 and another $53B out of 2028, about 6% and 3% of plan. It counts every builder in Texas, not just the Big Four.
Flat 2028 with the blue wave, our headline: $1.31T in 2027 and $1.35T in 2028, 18% below plan.
Four paths for AI capex
Worldwide AI capex, $T. Plan: pack 010’s base. Flat 2028: 2028 matches 2027’s plan. Blue wave: less the Texas capex packs 020 and 021 move out of each year.
Data
| AI capex, $B | 2026 | 2027 | 2028 | 2029 | 2030 | 2028 vs plan |
|---|---|---|---|---|---|---|
| Flat 2028 + blue wave | 1,000 | 1,311 | 1,347 | 1,579 | 1,736 | −18% |
| Flat 2028 | 1,000 | 1,400 | 1,400 | 1,570 | 1,739 | −15% |
| Plan + blue wave | 1,000 | 1,311 | 1,597 | 1,860 | 2,047 | −3% |
| Plan | 1,000 | 1,400 | 1,650 | 1,850 | 2,050 | 0% |
| Texas, pack 021’s cases | GW later, end-2027 | End-2028 | Out of 2027, $B | Out of 2028, $B | 2029, $B |
|---|---|---|---|---|---|
| Low | 1.52 | 2.01 | 36.5 | 11.8 | −1.2 |
| Base (used here) | 2.38 | 3.80 | 89.2 | 53.2 | −9.7 |
| Stress | 2.77 | 5.90 | 149.6 | 169.0 | −5.4 |
The 2029 figure is negative because the gap narrows: some of the delayed Texas load switches on that year.
Why 2028 takes the hit
Memory is bought before the chips ship. Pack 012’s model has about 35% of a year’s HBM bought the year before, as stacks move through CoWoS packaging, boards and buffers. 2027’s HBM is contracted and largely take-or-pay, so in the headline case it is bought on plan anyway, including the stacks meant for 2028’s chips; whatever 2027 buys beyond what the flat path needs, about 0.8 EB, is used up before 2028 orders anything new. Server orders placed late in 2027 for 2028’s builds go the same way. So 2028’s purchases fall harder than 2028’s capex: HBM bought in 2028 is 27% below plan, host DRAM in AI servers 23% and AI storage 23%, against 18% less capex.
Buyers hold stock they bought in the shortage. Korea Invest Insights estimates customers built 2–9 weeks of DRAM stock in 2026 and that restocking makes up 8–13% of 2027 DRAM shipments. When prices turn, that stock gets used instead of bought. We assume 3 weeks of demand comes out of 2028 orders.
Supply is already ordered. Micron expects industry DRAM bits to grow in the low 20s % in both 2027 and 2028, and NAND in the mid-20s %. SK hynix’s Yongin fab 1 opens its first cleanroom in February 2027; Samsung’s P5 takes tools from mid-2027 for mass production late in 2028; Micron’s Idaho fab ships from mid-2027, with a second Idaho fab and Japan late in 2028; CXMT goes from about 350,000 wafer starts a month at the end of 2026 to 500,000 by the end of 2028.
2028 DRAM demand falls 13.7% short of plan, and price has to win back 9.6 points
Headline case, 2028, DRAM demand as % of plan, with HBM counted at its wafer cost (about 2.9 conventional bits per HBM bit). Makers hold back 30% of the shortfall by delaying new tools; cheaper memory brings back the rest, and the price that does it is 47% below plan.
Data
| Bought for AI, 2028 | Units, M | HBM, EB | Host DRAM, EB | AI storage, EB |
|---|---|---|---|---|
| Flat 2028 + blue wave | 18.5 | 5.64 | 5.48 | 438 |
| Flat 2028 | 19.3 | 6.21 | 5.79 | 462 |
| Plan + blue wave | 22.0 | 7.19 | 6.82 | 545 |
| Plan | 22.7 | 7.76 | 7.12 | 569 |
Units are accelerator packages shipped (pack 012). HBM and host DRAM are what is bought in the year, after any stock carried in from 2027. HBM supply in 2028 is 8.0 EB in pack 012’s base case; what isn’t needed goes back to conventional DRAM at about 2.9 conventional bits per HBM bit.
How far prices fall: 2019 is the test
We have run this experiment before. Hyperscale capex rose 43% in 2018 and grew only modestly in 2019 (Synergy). In December 2018 Micron said customers had built higher-than-normal inventories, which it expected them to work down by the second half of 2019, and cut its capex plan by $1.25B. Contract prices fell nearly 30% in the first quarter of 2019 alone, and an 8 GB PC module went from $68 in the third quarter of 2018 to $25.50 by July 2019 (TrendForce). DRAM revenue fell 37.5% in 2019 (Gartner) while bit shipments kept growing, so the price per bit fell by around half.
Some of that was expected. In October and November 2018 TrendForce had 2019 bit output up about 22% and prices down 15–20%. Prices ended about a third below that path. The surprise was mostly stock: in January North American data centers held 5–6 weeks of server memory, about twice normal, and by March server and PC customers held more than seven weeks (TrendForce).
The 2022–23 downturn was slower but deeper: DRAM fell about 57% and NAND 55% from the third quarter of 2021 to the 2023 trough (Yole), as consumer demand fell first and cloud buyers cut last. Makers cut capex and wafer starts four to six quarters into the slide: SK hynix halved its 2023 capex, and Samsung cut output from April 2023. Contract prices bottomed that third quarter and rose in the fourth (TrendForce).
Our model fits how far demand bends to price to 2019’s surprise, not to the whole fall. About three weeks of excess stock and demand growth a few points short of what was expected, 8.6% of a year’s bits, with makers holding back 30% of it, clears 35% below the expected path. Then it adds what is new this time: HBM that vendors can put back on chips, AI budgets that buy more when memory is cheaper, and makers who say they will pace new tools to demand. A flat 2028 is the bigger shock: 13.7% of 2028’s DRAM demand goes missing against plan.
Prices and revenue by path
Annual averages. DRAM and NAND: contract price index, 2026 = 100. HBM: contract price, $ per GB. Revenue: DRAM including HBM, plus NAND. 2026 is actual or TrendForce’s current estimate; 2027–28 are modeled. 2029 is in the data.
In the headline case, conventional DRAM contract prices average 50% less in 2028 than in 2027, against 9% less on plan. With a flat 2028 alone, 2028 averages 46% less than 2027; with the blue wave alone, 19% less. The 2028 average is still about 3.1 times mid-2025’s.
2028 HBM contracts come in at about $20.1 per GB, against $30.8 in 2027 and $27.7 on plan, if half the commodity move reaches deals struck in the second half of 2027. With all of it, $14.6, about 2026’s $13.9.
NAND contract prices average 43% less in 2028 than in 2027, against 14% less on plan. On plan NAND already falls further than DRAM: TrendForce sees supply catching up in the second half of 2027.
DRAM and NAND revenue falls from $1.48T in 2027 to $0.95T in 2028, 36% less, instead of rising to $1.70T on plan. DRAM revenue alone falls 38%; in 2019 it fell 37.5%.
Data
| Annual average | Path | 2026 | 2027 | 2028 | 2029 | 2028 vs 2027 |
|---|---|---|---|---|---|---|
| DRAM, $/GB | Flat 2028 + blue wave | 14.44 | 18.83 | 9.34 | 14.73 | −50% |
| Flat 2028 | 14.44 | 19.50 | 10.62 | 14.70 | −46% | |
| Plan + blue wave | 14.44 | 18.83 | 15.35 | 16.53 | −18% | |
| Plan | 14.44 | 19.50 | 17.75 | 16.45 | −9% | |
| HBM, $/GB | Flat 2028 + blue wave | 13.92 | 30.76 | 20.09 | 22.31 | −35% |
| Flat 2028 | 13.92 | 30.76 | 21.41 | 22.27 | −30% | |
| Plan + blue wave | 13.92 | 30.76 | 25.75 | 25.03 | −16% | |
| Plan | 13.92 | 30.76 | 27.69 | 24.92 | −10% | |
| NAND, $/GB | Flat 2028 + blue wave | 0.235 | 0.292 | 0.166 | 0.220 | −43% |
| Flat 2028 | 0.235 | 0.313 | 0.176 | 0.219 | −44% | |
| Plan + blue wave | 0.235 | 0.292 | 0.253 | 0.243 | −13% | |
| Plan | 0.235 | 0.313 | 0.270 | 0.242 | −14% |
| Revenue, $B | Path | 2026 | 2027 | 2028 | 2029 |
|---|---|---|---|---|---|
| DRAM incl. HBM | Flat 2028 + blue wave | 619 | 1,062 | 661 | 1,154 |
| Flat 2028 | 619 | 1,093 | 743 | 1,151 | |
| Plan + blue wave | 619 | 1,062 | 1,072 | 1,324 | |
| Plan | 619 | 1,093 | 1,216 | 1,319 | |
| NAND | Flat 2028 + blue wave | 271 | 419 | 287 | 460 |
| Flat 2028 | 271 | 451 | 305 | 459 | |
| Plan + blue wave | 271 | 419 | 455 | 524 | |
| Plan | 271 | 451 | 486 | 521 |
$ per GB are blended contract prices across all products, set so 2026 revenue matches TrendForce’s $618.7B for DRAM and $270.6B for NAND; specific parts trade well above them (DDR4 8Gb at $27.50 a GB in October). HBM is about $1.74 per Gb in 2026 (our blend of HBM3E and HBM4) and +121% in 2027 (TrendForce). Revenue counts what is made after makers hold back supply, sold at the year’s average contract price; floors in long-term agreements would put realized prices above that. 2029 assumes makers hold back 60% of that year’s shortfall.
Reading the paths
On plan, 2028 is a mild correction. DRAM peaks in the second quarter of 2027 and gives back 3% in the second half, as Citi expects, then drifts lower in 2028 as new fabs arrive; Bernstein expects 2028 to normalize, more mildly than it first thought. NAND peaks earlier: TrendForce has supply catching up from the second half of 2027. Annual averages: DRAM −9% and NAND −14% in 2028.
Flat 2028 is 2019 and then some. On its own it takes DRAM 46% below 2027 and NAND 44%. The blue wave adds to 2028’s fall and takes some of 2027’s rise away: HBM is contracted, but much conventional DRAM and NAND is still priced month to month or quarter to quarter, so 2027 averages 3% below plan for DRAM and 7% for NAND. On its own, with 2028 capex still growing, the blue wave leaves 2028 DRAM 14% below plan. We count every dollar of Texas capex that leaves 2027 as hardware nobody buys that year. Alphabet and Microsoft say demand exceeds what they can supply (pack 021), so some of those chips would go elsewhere; if all of them did, the headline would be −48% instead of −50%.
HBM falls less. HBM and DDR5 come off the same wafers, and an HBM bit takes about three times the wafer of a DDR5 bit. When AI buys less HBM, makers move the spare wafers back to DDR5, so conventional DRAM takes most of the fall. 2028’s HBM deals are struck in the second half of 2027, before 2028 budgets are final, so we pass half of the pool’s move through to them: $20.1 per GB, against $30.8 in 2027. If all of it comes through, $14.6, about 2026’s price.
Revenue falls back toward 2026’s level. $1.48T in 2027 becomes $0.95T in 2028, against $0.89T in 2026. The makers stay very profitable: the 2028 DRAM price in the headline case is still about 3.1 times its mid-2025 level.
2029 is mostly about the makers. If they cut 2029 supply as hard as they did in 2023, holding back 60% of the shortfall, prices recover much of the way to plan in 2029; if they don’t, they stay down. The 2029 figures are in the data under the chart; treat them loosely.
What moves the answer
Headline case, 2028 DRAM contract price against 2027, changing one input at a time. Orange: deeper fall; blue: shallower.
Data
| Input | Low setting | DRAM | NAND | High setting | DRAM | NAND |
|---|---|---|---|---|---|---|
| Stock buyers run down in 2028 | none | −39% | −29% | 6 weeks | −60% | −55% |
| Supply makers hold back in 2028 | none | −62% | −53% | 60% of the gap | −35% | −30% |
| How far demand bends to price | 6% surprise | −59% | −54% | 12% surprise | −43% | −36% |
| AI budgets stretch further | not at all | −54% | −44% | full strength | −47% | −42% |
| Blue wave (pack 021’s cases) | none | −46% | −44% | stress | −58% | −46% |
Headline: DRAM −50%, NAND −43%, HBM −35%. “How far demand bends” refits the elasticities to a 2019 surprise of 6% of a year’s bits (the excess stock alone) or 12%, instead of 8.6%. Fitted to all of 2019’s fall instead of the surprise, the headline would be −58%.
Where we sit against the forecasters
Counterpoint’s Kang, the one forecaster we found who ties 2028 to capex, expects prices to hold through 2027 and fall in 2028 as capex growth approaches zero, and put declines of 20–30% on the table. Bernstein’s July note had SK hynix’s DRAM price peaking at the end of 2027 and falling about 53% in 2028; in September it said 2028’s normalization would be milder than it had expected. Our headline is near Bernstein’s July case. It falls further than Counterpoint’s for three reasons: 2027’s contracted HBM that 2028 must work through, the stock buyers built in the shortage, and supply that grows about a fifth in 2028 because the tools are already ordered. If makers hold back 60% of the shortfall instead of 30%, we get −35%: closer to Counterpoint, though still a deeper fall.
What would soften it
- Discipline. Samsung says a large share of its 2027 capex increase goes to space and cleanrooms, with equipment adjusted flexibly to demand; SK hynix says Yongin’s cleanrooms open in phases based on demand. Tools deferred in late 2027 come straight out of 2028’s bits.
- HBM going back on chips. Vendors cut memory per package because HBM was short and dear, and chipmakers are reportedly evaluating 8-Hi stacks for Rubin Ultra and next year’s custom chips (TrendForce). Pack 012’s announced specs need about 45% more HBM in 2028 than the trimmed ones. Cheap HBM gets put back, if 2028 parts can take taller stacks in time.
- Phones and PCs. IDC has smartphone shipments down 16.7% this year, with DRAM and NAND costs up more than 300%, and TrendForce expected low-end phones to go back to 4 GB base models in 2026. Lower prices bring back both units and memory per device, with a lag of a product cycle.
- Flat dollars, more chips. Memory is about 30% of hyperscaler spending this year (SemiAnalysis); on plan we have DRAM at 21% of 2028’s AI capex and NAND at 9%. With budgets fixed in dollars, cheaper memory buys more servers. At half strength, that brings back about 4% of AI DRAM demand in 2028.
- Floors. Three-quarters of the revenue in Micron’s strategic agreements has a defined pricing framework, most of it with floor and ceiling prices, and SanDisk’s agreements carry $93.9B of minimum revenue at floor prices. They protect makers’ revenue, not market prices.
What would make it worse
- China. CXMT adds about 150,000 wafer starts a month between the end of 2026 and the end of 2028, and Citi names Chinese capacity as the main risk to its call.
- Contracts that push the shortfall onto the open market. If buyers must take contracted volumes, the whole shortfall lands on what is left: contract and spot prices fall further, even as the makers’ own average price holds up.
- More stock than we assume. Six weeks of destocking instead of three takes the headline to −60%.
- A harder Texas. Pack 021’s stress case, with the Texas House flipped and a moratorium to the end of 2027, gives −58%.
What to watch
Spot against contract. Spot usually turns first: in October 2018, as 2019’s slide began, DDR4 spot was already below contract ($6.95 against $7.31, TrendForce). Today DRAM spot is flat at about 70% above contract, and NAND wafer spot is falling.
Late January and early February 2027. Fourth-quarter results bring the first 2027 capex guides from Alphabet and Meta and Amazon’s “meaningfully more.” Any 2028 color, and whether capex keeps outrunning operating cash flow, matters more for memory than any governor.
TrendForce’s first-quarter 2027 contract outlook, due around the turn of the year. A rise under 5% for DRAM would fit the peak-in-2027 camp.
Mid-2027: tool-in at Yongin and P5, and 2028 HBM negotiations. 2027’s deals closed in September and October; where 2028’s land, and whether buyers hold back, is the first hard read on 2028.
Inventory. Micron’s inventory days rose by 9 last quarter to 129. Rising supplier inventory alongside falling spot is how 2019 began.
What this is anchored on
Prices, guidance and estimates are as reported. The capex paths are packs 010, 020 and 021’s; units and HBM are pack 012’s; the price response, the plan path after 2026 and the revenue are ours.
| Item | Data point | Source |
|---|---|---|
| Prices | 4Q26 forecast: DRAM +10–15%, NAND +15–20%; enterprise SSD the only NAND category still accelerating | TrendForce, Sep 30 |
| Prices | 1Q26 conventional DRAM contract prices +93–98% (actual, against a +90–95% forecast) | TrendForce, Jun 1 |
| Prices | 2Q26 forecast: DRAM +58–63%, NAND +70–75% | TrendForce, Mar 31 |
| Prices | 3Q26 forecast: DRAM +13–18%, NAND +10–15% | TrendForce, Jul 3 |
| Prices | 1Q26 NAND +55–60%; 4Q25 DRAM +45–50% | TrendForce via Evertiq, Feb 2 |
| Prices | DDR4 8Gb contract $27.50 in October, a record and the 19th monthly rise; 128Gb MLC flat, ending a 21-month rise | TheElec, Oct 30 |
| Prices | DDR4 8Gb contract $1.35 in January–March 2025 | Silicon Analysts, DRAMeXchange data |
| Spot | DDR4 8Gb spot $46.32, unchanged on the week; 512Gb TLC wafer $18.83 | TrendForce, Oct 7 |
| Spot | DDR4 8Gb spot $46.82, −0.09% on the week and above suppliers’ quotes; 512Gb TLC wafer $16.15, −4.33% | TrendForce, Nov 4 |
| Spot | 512Gb TLC wafer spot −9.19% in a week as Chinese phone brands discount | TrendForce, Oct 28 |
| HBM | 2027 blended HBM price +121%; chipmakers evaluating 8-Hi stacks, which cost 10–20% more per Gb than 12-Hi | TrendForce, Sep 29 |
| HBM | HBM4 12-Hi 36 GB stack about $600 in 2026 and $1,300 in 2027 (industry estimates reported by Seoul Economic Daily) | Silicon Analysts, Oct 1 |
| Revenue | 2026 DRAM $618.7B and NAND $270.6B; 2027 DRAM $903.3B and NAND $379.4B (May forecast) | TrendForce, May 29 |
| Makers | SK hynix: 80% operating margin in 3Q; DRAM and HBM effectively sold out through 2029; long-term agreements over half of 2027–28 capacity | TrendForce, Oct 28 |
| Makers | SK hynix: 2027 volumes and prices finalized; customers reviewing project timing, some adjusting HBM specs; industry DRAM demand up mid-20s% in 2027 | SK hynix 3Q26 call, Oct 27 |
| Makers | Samsung: 2027 HBM sold out at target prices | Seoul Economic Daily, Oct 29 |
| Makers | Micron: industry DRAM bit shipments up low-20s% in both 2027 and 2028, NAND mid-20s%; gross margin 87%; 26 strategic agreements, over 35% of revenue to 2030, three-quarters of it with a defined pricing framework, a majority with floor and ceiling prices; Idaho ID1 mid-2027, ID2 and Japan late 2028 | Micron, Sep 30 |
| Makers | SanDisk: gross margin 85.1%; about half of FY27 bits and two-thirds of FY28 under long-term agreements; data center about half of NAND bits, data-center bit demand up about 40% in 2027 | SanDisk call, Oct 29 |
| Makers | SanDisk agreements: $93.9B of minimum revenue at floor prices | SanDisk investor materials, Oct 29 |
| Balance | DRAM 1–2% short in 2026 and wider in 2027 | TrendForce, Jul 30 |
| Balance | NAND 4–5% short in 2026, turning to surplus in the second half of 2027; server over 40% of NAND bit demand | TrendForce, Jul 21 |
| Balance | HBM 18%, 22% and 30% of the big three’s DRAM wafer starts in 2025–27, and 8%, 9% and 13% of bits | TrendForce, Jun 2 |
| Balance | 2026 DRAM shipments: servers 48%, HBM 9%, mobile ~22%, PCs ~10% | Counterpoint via TechTimes, Jul 1 |
| Forecasts | DRAM and NAND prices peak in 2Q27; 2H27 DRAM −3% and NAND −5% half on half; Chinese capacity the main risk | Citi, Aug 7 |
| Forecasts | Counterpoint’s Kang Kyung-soo at iForum 2026: prices stable from 4Q26 through 2027, then a fall in 2028, with DRAM and NAND declines of 20–30% possible; Big Tech capex growth approaching 0% in 2028; capex over 80% of operating cash flow | BigGo Finance, Oct 22 |
| Forecasts | 2028 normalizes, more mildly than previously forecast; DRAM gross margin about 90% at the peak, high 70s% by end-2028 | Bernstein via Tiger Brokers, Sep 29 |
| Forecasts | SK hynix DRAM price peaking at the end of 2027 and falling about 53% in 2028 | Bernstein via Yahoo Finance, Jul 7 |
| Forecasts | 2027 commodity DRAM +40%, NAND +32%, HBM +121% | KB Securities via FN News, Nov 2 |
| Capex | Large US hyperscalers about $1.2T in 2027 and $1.4T in 2028, against a consensus near $1.3T | Goldman Sachs via TechFlow, Sep 25 |
| Capex | Hyperscalers and AI cloud providers $1.58T in 2027 and $1.8T in 2028 | Morgan Stanley via Fortune, Oct 19 |
| Capex | S&P Global’s models generally assume capex flattens in 2028 | Yahoo Finance, Sep 6 |
| Capex | Memory about 30% of hyperscaler spending in 2026, against about 8% in 2023–24 | SemiAnalysis via Tom’s Hardware, Apr 3 |
| Capex | Worldwide AI capex plan; Texas GW paths; capex leaving 2027 | 06.ai packs 010, 020 and 021 |
| AI memory | Accelerator units, HBM per package and HBM supply | 06.ai pack 012 |
| AI memory | Nvidia reportedly halves Vera Rubin SOCAMM capacity; memory near 29% of the system bill of materials | TrendForce, Jul 28 |
| AI memory | Nvidia’s context-memory storage tier: up to 16 TB per GPU | Blocks & Files, Jan 12 |
| Devices | Smartphone shipments −16.7% in 2026; DRAM and NAND costs up over 300% year on year | IDC, Aug 26 |
| Devices | Low-end smartphones likely back to 4 GB base models in 2026 | TrendForce, Dec 11, 2025 |
| Devices | PC shipments −11.3% in 2026 | IDC, Jun 2 |
| Inventory | Customers built 2–9 weeks of DRAM stock in 2026; restocking 8–13% of 2027 shipments | Korea Invest Insights, Oct 30 |
| Supply | Samsung: a large share of the 2027 capex increase goes to space and cleanrooms; equipment adjusted flexibly to demand | BusinessPost, Oct 29 |
| Supply | SK hynix Yongin fab 1 first cleanroom February 2027 | Reuters via MarketScreener, Jan 15 |
| Supply | Samsung P5 phase 1: tools from mid-2027, mass production late 2028 | TechTimes, Sep 7 |
| Supply | CXMT about 265k wafer starts a month at end-2025, 350k at end-2026, 420k at end-2027, 500k at end-2028 | SemiAnalysis via XenoSpectrum, Jul 16 |
| 2019 | 2019 DRAM bit output up nearly 22%; prices down 15–20% | TrendForce, Oct 9, 2018 |
| 2019 | Micron: customers carrying higher-than-normal inventory, worked down by 2H19; capex cut by $1.25B; DRAM bit output growth held to about 15% | Electronic Design, Dec 2018 |
| 2019 | Hyperscale capex +43% in 2018 | Synergy Research, Mar 2019 |
| 2019 | Hyperscale capex growth only modest in 2019 | Synergy Research, Mar 2020 |
| 2019 | 8 GB PC module $68 in 3Q18; 2019 DRAM prices down as much as about 20%; October DDR4 8Gb contract $7.31, spot $6.95 | TrendForce, Nov 5, 2018 |
| 2019 | North American data centers holding 5–6 weeks of server DRAM, about double normal | TrendForce, Jan 21, 2019 |
| 2019 | First-quarter contract prices down nearly 30%, the steepest fall since 2011 | TrendForce via TechPowerUp, Mar 6, 2019 |
| 2019 | Server and PC customers holding over 7 weeks of inventory, suppliers over 6 | TrendForce, Mar 25, 2019 |
| 2019 | 8 GB module $25.5 by July 2019 | TrendForce, Aug 8, 2019 |
| 2019 | DRAM revenue −37.5% in 2019 | Gartner via Computing, Jan 2020 |
| 2022–23 | DRAM −57% and NAND −55% from 3Q21 | Yole via StorageNewsletter, Jul 2023 |
| 2022–23 | 2022 DRAM sufficiency +7.9% (supply +18.7%, demand +11.9%) | Mirae Asset, May 2023 |
| 2022–23 | SK hynix cuts 2023 capex by more than half | Tom’s Hardware, Oct 2022 |
| 2022–23 | Samsung’s production cut, April 2023 | KED Global, Apr 2023 |
| 2022–23 | Contract prices bottomed in 3Q23; 4Q23 forecast +13–18% as Samsung deepened its cuts | TrendForce, Dec 4, 2023 |
Method
Capex. Worldwide AI capex on pack 010’s base: $1.0T in 2026, $1.40T in 2027, $1.65T in 2028, $1.85T in 2029 and $2.05T in 2030. Flat 2028 sets 2028 equal to 2027’s plan, then applies the plan’s growth rates. The blue wave takes pack 020’s Texas paths (gigawatts switched on, Abbott’s path less the Democratic outcome) and prices them as pack 021 did: 2.4 GW by the end of 2027 at $50B a GW, 75% of it leaving the year, is $89B; the gap widening to 3.8 GW by the end of 2028 takes $53B more. Low and stress cases are pack 021’s.
Memory for AI. Accelerator packages are pack 012’s base by family, scaled each year by the path’s AI capex against plan, so a cut falls evenly on chips and buildings (pack 019’s rule). HBM bought in a year is pack 012’s K × [(1 − L) × C(y) + L × C(y + 1)], with L = 0.35, K = 1.06 and C the HBM in the year’s shipments at trimmed specs. Host DRAM per package: 240 GB per Blackwell GPU (Grace), 448 GB per Rubin GPU (Vera, between the reported cut and the full 1.5 TB per CPU), x86 hosts about 256 GB per GPU, TPUs and Trainium 160–256 and 128–224 GB, AMD 384–500 GB; a quarter is bought the year before. AI storage is 20–26 TB of NAND per package, including the share of training data and context-memory tiers, which puts AI at more than half of data-center NAND. 2026 is history. 2027’s HBM and the late-2027 orders for 2028’s builds are bought on plan; anything beyond the path’s need is used up first in 2028.
Supply and the plan balance. DRAM is one wafer pool counted in conventional-equivalent bits, with an HBM bit worth 2.9 (TrendForce: HBM 30% of 2027 wafers for 13% of bits). DRAM output is about 43 EB in 2026, HBM 3.9 EB of it, growing 22% in 2027 and 21% in 2028 (Micron, low 20s %) and 18% in 2029. NAND is about 1,150 EB in 2026, growing 25% in 2027–28 and 20% after. Plan demand sits at the published balance: DRAM −1.5%, −3.5% and −2.0% in 2026–28 (supply over demand, less one); NAND −4.5%, 0.0% and 2.0%. Non-AI demand is plan demand less AI.
Clearing. Supply is fixed by fabs already built or tooling. In each path and year we solve for the price against plan, p, at which demand equals plan demand times the path’s supply over plan supply. Each segment’s demand moves with p to the power −e: HBM 0.3 (vendors restoring stacks; HBM’s contract price moves as p to the power 0.5 in 2028), host DRAM 0.118, other DRAM 0.148, AI storage 0.222, other NAND 0.178. AI segments also gain from fixed budgets buying more, units × [1 / (1 − m + m c)]^0.5, where m is the memory’s share of AI capex at plan prices (DRAM 21% and NAND 9% in 2028) and c its cost against plan, with HBM at its own price (63% of the AI DRAM bill). In the year a flat path turns, buyers run down 3 weeks of demand and makers hold back 30% of the shortfall; in later years they hold back 60%, as capex cut in 2028 lands. HBM contracts are fixed for 2027 and take 50% of the pool’s move in 2028. The elasticities other than HBM’s keep fixed proportions and are scaled together to 2019’s surprise: TrendForce expected 2019 prices to fall 15–20%; with revenue down 37.5% and bit output growing in the teens, the price per bit fell by around 45–48%, about 35% below the expected path. We put the shortfall behind that at 8.6% of a year’s bits (three weeks of excess stock and demand growth 3 points short of what was expected), with makers holding back 30% of it.
Prices. Quarterly contract prices to 4Q26 chain TrendForce’s midpoints. Chained, they put 4Q26 conventional DRAM at about six times 3Q25. The plan path then follows published views: DRAM +6% and +3% in the first two quarters of 2027 and −3% in each of the last two (−3.0% half on half, as Citi expects), then −2.5% a quarter in 2028 (ours); NAND +4%, 0%, −3% and −4% (−4.9% half on half), then −4% a quarter. 2026 average prices are set so revenue matches TrendForce’s 2026 figures; HBM is $1.74 per Gb in 2026 (our blend of HBM3E and HBM4), +121% in 2027 (TrendForce) and −10% a year on plan after. Each path’s annual average is the plan’s times p.
Known limits. Every elasticity is a judgment fitted to one downturn’s surprise, and the tornado shows how much rides on it. Annual steps hide timing: in a flat 2028 we would expect spot to turn in late 2027, as 2028 budgets are set, and contract prices a quarter or two later. China’s domestic market is not modeled separately. The model doesn’t value the makers or their shares. This is analysis, not investment advice.